Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of two part silver conductive epoxy systems, the EP77M-F has a one-to-one mix ratio, by weight or volume. It will set up at ambient temperatures within 5-7 minutes even when mixed in very small amounts. It then develops a high bond strength of more than 1800 psi tensile shear when fully cured at room temperature. Electrical conductivity develops rapidly and is first detectable within 30-60 minutes. Full cures usually take about 8-12 hours at room temperature. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is a very low 10^-3 ohm-cm.

Master Bond Polymer System EP77M-F can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +125°C. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored silver. Master Bond EP77M-F adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive industries.