Master Bond Polymer System EP51FL is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing, EP51FL offers a relatively rapid cure, with a setup time in most cases of about 30-40 minutes and full cure within 24 hours at room temperature. In addition, EP51FL will cures more quickly at elevated temperatures. It has a convenient one to one mix ratio by weight or by volume. The cured compound exhibits a remarkably high peel strength of more than 25 pli along with an elongation of greater than 75%. EP51FL will form flexible, high strength bonds on many different substrates including metals, glass, ceramics, wood, various rubbers and many plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP51FL is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where good flexibility and fast cure are desirable property traits. EP51FL withstands thermal and mechanical shocks and has superb resistance to thermal cycling. In addition, EP51FL has been used in cryogenic applications as both an adhesive and sealant. Its service temperature range is 4K to 250°F. A paste version called EP51FLND is also available when a "non-drip" system is required. Also, EP51FL will cure at colder temperatures, as low as 20°F; although it will cure more slowly at room temperature.