Master Bond EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding, coating and sealing. It has a forgiving one to one mix ratio by weight. After mixing, it flows smoothly and easily. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The cure schedules are outlined below in the charts, with the optimum cure being overnight at ambient temperature followed by a heat cure at 150-200°F for 2-3 hours. This epoxy has exceptionally low volume resistivity and it retains this feature for years. Recent testing performed on a specimen over 25 years old confirmed that it was just as conductive today as it was decades ago. It is 100% reactive and contains no solvents and diluents. Additionally, it has very low shrinkage upon curing.
It bonds well to many substrates, including composites, metals, glass, ceramics, rubbers and plastics. The system’s robust flexibility enables it to withstand severe thermal cycling as well as intense thermal and mechanical shocks. Also, EP21TDCSFL imparts very little mechanical stress on sensitive components and substrates. Since it is silver filled, the system is a reliable thermal conductor as well. It has good chemical resistance to water, oils and fuels. Parts A and B are both colored silver. It is cryogenically serviceable over a temperature range of 4K to +250°F. Another attractive feature is its ability to seal and fill gaps up to 1/8 inch thick. This system can be used in the electronic, electrical, semiconductor, electro-optic, aerospace and specialty OEM applications. One example includes stress relief for die attach when there are large thermal mismatches. Another is for electrical connections between electrodes in ultrasound applications.
Product Advantages
- Convenient mixing, forgiving 1:1 mix ratio by weight
- Easy to apply, superb flow properties
- Versatile cure schedules
- Outstanding electrical and thermal conductivity
- Cures flexible, withstands strenuous thermal cycling
- Remarkable retention of electrical conductivity
