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| White Paper: Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing |
Die attach adhesives play a critical role in semiconductor assembly and throughout the product life cycle. This white paper explains how these adhesives facilitate the assembly process and enhance reliability. Learn why thin bond lines are so important for product life cycle as well as the many performance characteristics of epoxies that are essential in meeting demanding application needs.
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| Supreme 3HTND-2DA: Convenient Processing & Dispensing |
Well suited for die attach applications, single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C. This toughened system has high die shear strength, superior electrical insulation properties, excellent thermal conductivity, low ionics and performs well in 85°C/85% RH testing. It also passes NASA low outgassing tests.
For more information, request a technical data sheet on Supreme 3HTND-2DA |
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Copyright  2017 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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February 2017
